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ICEPAK Hands on Workshop

Advanced Electronics Thermal Management

27 March 2008


 

Introduction

 

Management of high local heat fluxes has become a critical issue for the Electronics Industry due to rapid increases in compute power and associated thermal loadings.

ANSYS' CFD solutions allows thermal management solutions to be evaluated quickly and early in the design cycle. This results in much better designs, shortened time-to-market, significant cost-savings and higher customer satisfaction.

 

ICEPAK  

 

ANSYS ICEPAK is a fully interactive, object-based thermal management and optimization solution for electronics systems and components at every phase of the development cycle.

Built upon the world’s leading and industry-proven FLUENT solver and ICEM CFD meshing technology, Icepak delivers more speed, more complex problem-solving with robustness and more computational efficiency than any other thermal modeling software.
 

ANSYS Icepak gives unprecedented accuracy in thermal analysis with:

  • Advanced hexa-unstructured meshing technology, allowing meshing of curves, inclined objects and non-rectangular components needed to build high-quality realistic models for today’s complex designs.

  • Second-order scheme which produces more accurate temperature gradients compared to first order schemes normally used.

  • Ability to take into account the joule-heating effects of traces and vias, normally ignored.


ANSYS Icepak gives much faster results through:

  • Easy-to-use, powerful and highly automated meshing technology.

  • Parallel processing capability, allowing the most complex designs to be analyzed and convergence reached in the shortest time.

  • Ability to transfer files to ANSYS Multiphysics solutions for sequential coupled field analysis.
     

Please click here for detailed product features.

 

 

Who Should Attend?     

  • R&D Directors / Managers

  • Thermal / Mechanical Engineers

  • Electronics Engineers

  • Project Managers

  • Anyone involved in thermal management issues in the Electronics Industy

 

Temperature distribution and cooling airflow in an electronics enclosure.

 

Workshop Highlights

  • ANSYS In Electronics - Solution Overview

  • System Level Thermal Management

  • Hexa – unstructured Meshing Technology

  • Non – conforming Mesh Algorithm

  • Importance of trace/joule heating effects

  • Case studies
     

 

Omega heat sink - mesh follows the geometry exactly

       Omega heat sink - mesh follows the geometry exactly

Contours of temperature

Contours of temperature on the unit

Animation showing contours of temperature and path lines from the fan - colored by temperature

 

Testimonials

 

"The results of our model demonstrated that the proposed thermal management solution can adequately cool the appliance's components.  The icepak simulations helped the design team to optimize a thermal management solution before the fabrication of actual hardware.  Now, it will be possible to build prototype hardware with a suitable cooling scheme on the first attempt.  The parametric capability of Icepak made it possible to optimize many parameters to provide the best solution that meets all of the system requirements."

 

Javier Leija, Intel

 

"We performed all of the structural analysis on a chassis using the information gained from the Icepak analyses, as the thermal scheme drove the structural design.  We also used icepak at each design stage, simulating the conditions before the engineers ran tests.  The results always fell within 10% of the actual test results, cutting down on the time and money we spent in making modifications during the prototyping phase."

 

Mario D'Angelo, Jabil Circuit

Workshop Information

 

       

Date               :      27 March 2008 (Thursday)

Time               :     2:00 pm - 5:00 pm

 Venue            :     CAD-IT Training Centre         

 

 

For more information or enquiries, please contact Mr Kelvin Lim at 6508 7562 (kelvin.lim@cadit.com.sg) or register at our event website.

 

 About CAD-IT

Formed in 1991, CAD-IT is a leading PLM solution, manufacturing and education provider to over 1,600 companies throughout South East Asia and China.  With 7 offices and 2 manufacturing plants in SEA and China, CAD-IT's mission is in providing world-class solutions and services that enable companies and their supply chains to achieve greater product innovation, quality and productivity with drastically reduced time-to-market and costs.   CAD-IT is extremely honoured to have received 51 International Awards since its inception for marketing and service excellence.  

 

As an exclusive partner of ANSYS, Inc. in the ASEAN region, CAD-IT has a proven track record of success and is extremely honored to have received 8 ANSYS Outstanding Performance Award over the past 11 years, consecutively from years 1998 to 2000 and from 2002 to 2006 in recognition of her excellence in marketing, provision of training, consulting and technical support of the entire range of ANSYS solutions.

 

About ANSYS, Inc.

ANSYS, Inc., founded in 1970, develops and globally markets engineering simulation software and technologies widely used by engineers and designers across a broad spectrum of industries. The Company focuses on the development of open and flexible solutions that enable users to analyze designs directly on the desktop, providing a common platform for fast, efficient and cost- conscious product development, from design concept to final-stage testing and validation. The Company and its global network of channel partners provide sales, support and training for customers. Headquartered in Canonsburg, Pennsylvania, U.S.A., with more than 40 strategic sales locations throughout the world, ANSYS, Inc. and its subsidiaries employ approximately 1,400 people and distribute ANSYS products through a network of channel partners in over 40 countries. Visit www.ansys.com for more information.

ANSYS, ANSYS Workbench, AUTODYN, CFX, FLUENT and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries ICEM CFD is a trademark used by ANSYS, Inc. under license. All other brand, product, service and feature names or trademarks are the property of their respective owners.


CAD-IT CONSULTANTS (ASIA) PTE LTD

159 Sin Ming Road, #03-05 Amtech Building (Lobby 2), Singapore 575625

Tel: (65) 6508-7575     Fax: (65) 6454-3766     Email: caditevents@cadit.com.sg    Website: http://www.cadit.com.sg/

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