



Thermoelectric cooler model including the Peltier and Seebeck effects, current density (top) and temperature (bottom) shown 
In an expanding range of applications, engineers and designers must be able to accurately predict how complex products will behave in realworld environments where multiple types of coupled physics interact. Multiphysics simulation software from ANSYS allows you to create virtual prototypes of your designs operating under realworld multiphysics conditions. This industry leading software enables you to simulate the interaction between structural mechanics, heat transfer, fluid flow and electromagnetics all within a single, unified engineering simulation environment.





Solution Capabilities

A conjugate heat transfer solution and subsequent thermalstress analysis of a computer graphics card. Fluid streamlines and solid temperatures (left) and thermal stresses (right) are shown for the coupled simulation. 
Multiphysics simulation from ANSYS enables engineers and designers to create virtual prototypes of their designs operating under realworld multiphysics conditions. ANSYS Multiphysics provides to the analysis industry the most advanced coupled physics technology within a unified simulation environment, which allows you to simulate the interaction between structural mechanics, heat transfer, fluid flow, acoustics and electromagnetics.
Features include:

Superior solvers for all physics simulations

Structural mechanics, heat transfer, fluid flow and electromagnetic

Flexible multiphysics simulation built on proven solver technology

A unified simulation environment for multiphysics analysis

Fully parametric analysis allows design of experiments, robust design and design optimization for multiphysics solutions

Parallel scalability for multiphysics analysis

World class support and services from ANSYS

Solution Benefits

The ANSYS Workbench platform is a powerful multiphysics simulation environment. The project schematic shows the multiphysics workflow for a coupled electric conduction, heat transfer and subsequent thermal stress analysis. 
ANSYS continues to lead the simulation industry in the development of multiphysics solutions that provide the highfidelity simulations required to meet the challenges of today’s demanding product development requirements. ANSYS Multiphysics provides analysts with a powerful simulation tool for solving industry’s most challenging multiphysics applications. 
Solutions Chart

Fluidstructure interaction of a threelobe valve, simulation solved using
the ANSYS Multifield Solver. The model includes NonNewtonian blood flow
and anisotropic hyperelasticity to model the biological tissue. 
Structural Analysis

Static, modal, harmonic and transient analysis

Spectrum analysis

Buckling analysis

Random vibration

Geometric, material and contact nonlinearities

Displacements transferred to thermal, electric, magnetic or fluid analysis
Thermal Analysis

Steadystate and transient analysis

Spectrum analysis

Conduction, convection and radiation

Phase change

Mass transport

Fluid elements

Temperaturedependent material properties

Temperatures transferred to structural, electric, magnetic or fluid analysis
Electrostatic Analysis

Chargebased electric elements

Trefftz method for open domain

Electrostatic forces transferred to structural analysis
SteadyState Current Conduction

Currentbased electric elements

Infinite elements for open domain

Currents transferred to magnetostatic analysis

Resistive losses transferred to thermal analysis
LowFrequency Electric Field Analysis

Charge and current based elements

Infinite elements for open domain

Timeharmonic and timetransient quasistatic

Resistive and dielectric losses transferred to thermal analysis

Currents transferred to magnetic analysis
Magnetostatic Analysis

Magnetic vector potential and scalar potential elements

3D edge flux element formulation

Resistive losses transferred to thermal analysis

Magnetic forces transferred to structural analysis
LowFrequency Magnetic Analysis

Magnetic vector potential elements

3D edge flux formulation

Quasistatic magnetic

Timeharmonic analysis for linear materials

Timetransient analysis for linear and nonlinear materials

Permeable and saturable materials

Permanent magnets

Resistive and eddy current losses transferred to thermal analysis

Magnetic forces transferred to structural analysis
HighFrequency Electromagnetic Analysis

First and secondorder tangential vector elements

3D brick, pyramid, prism and tetrahedral element shapes

Cavity modal analysis

Harmonic analysis: wave propagation, radiation and scattering

Isotropic and anisotropic materials

SPICEequivalent circuit output

Resistive and dielectric losses transferred to thermal analysis
Circuit Analysis and Coupling

Coupled electromagnetic field analysis and discrete electric circuits

Resistors, capacitors, inductors, diodes, transformers, voltage and current sources

Electromechanical transducer

Interactive circuit builder

Coupling to both stranded and massive conductors
Ion Optics

Chargedparticle tracing in electric or magnetic static fields, or both

Plot trajectories in 2D or 3D

Fluid Flow Analysis

Tetrahedral, hexahedral, prism and/or pyramid elements

Steadystate and transient flow

Laminar and turbulent flows

Incompressible, compressible – subsonic, transonic, supersonic

Rotating or stationary frame of reference

Conjugate heat transfer

Radiation

Newtonian and nonNewtonian fluids

Userdefined equations and species transport

Free surface modeling

Fluid structure interaction

Fluid pressures and temperatures transferred to structural analysis

Heat flux and temperatures transferred to thermal analysis
Acoustics

Modal, harmonic and transient analysis

Fluid medium

Fully coupled fluid–structural
Direct CoupledField Elements

Piezoelectricity

Piezoresistivity

Piezocaloric effect – Thermoelastic damping

Coriolis effect

Electroelasticity

Thermoelectricity – Joule heating, Peltier, Seebeck and Thomson effects

Thermal–structural

Thermal–electric–structural
Sequential Coupling Options

Electrostatic–structural

Electrostatic–structural–fluid

Thermal–structural

Thermal–electric

Thermal–electricstructural

Thermal–electric–fluid

Thermal–fluid

Electromagnetic–thermal

Electromagnetic–structural

Electromagnetic–fluid

Electromagnetic–thermal–structural

Fluid structure interaction
Optimization

Design optimization

Topological optimization

Probabilistic design

Variational technology

Parametric simulation
ANSYS Parametric Design Language

Macros

Parametric modeling

Ifthenelse constructs

Doloop features

Array parameters

Array parameter operations

Trigonometric functions
Solvers

Sparse direct

Jacobi conjugate gradient (JCG)

Incomplete Cholesky conjugate gradient (ICCG)

Preconditioned conjugate gradient (PCG)

Quasiminimal residual (QMR)

Algebraic multigrid (AMG)

Eigensolvers

Block Lanczos

PCG Lanczos

Supermode modal solver

Householder (reduced)

Unsymmetric QRdamped


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