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Thermoelectric cooler model including the Peltier and Seebeck effects, current density (top) and temperature (bottom) shown |
In an expanding range of applications, engineers and designers must be able to accurately predict how complex products will behave in real-world environments where multiple types of coupled physics interact. Multiphysics simulation software from ANSYS allows you to create virtual prototypes of your designs operating under real-world multiphysics conditions. This industry leading software enables you to simulate the interaction between structural mechanics, heat transfer, fluid flow and electromagnetics all within a single, unified engineering simulation environment.
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Solution Capabilities
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A conjugate heat transfer solution and subsequent thermal-stress analysis of a computer graphics card. Fluid streamlines and solid temperatures (left) and thermal stresses (right) are shown for the coupled simulation. |
Multiphysics simulation from ANSYS enables engineers and designers to create virtual prototypes of their designs operating under real-world multiphysics conditions. ANSYS Multiphysics provides to the analysis industry the most advanced coupled physics technology within a unified simulation environment, which allows you to simulate the interaction between structural mechanics, heat transfer, fluid flow, acoustics and electromagnetics.
Features include:
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Superior solvers for all physics simulations
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Structural mechanics, heat transfer, fluid flow and electromagnetic
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Flexible multiphysics simulation built on proven solver technology
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A unified simulation environment for multiphysics analysis
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Fully parametric analysis allows design of experiments, robust design and design optimization for multiphysics solutions
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Parallel scalability for multiphysics analysis
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World class support and services from ANSYS
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Solution Benefits
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The ANSYS Workbench platform is a powerful multiphysics simulation environment. The project schematic shows the multiphysics workflow for a coupled electric conduction, heat transfer and subsequent thermal stress analysis. |
ANSYS continues to lead the simulation industry in the development of multiphysics solutions that provide the high-fidelity simulations required to meet the challenges of today’s demanding product development requirements. ANSYS Multiphysics provides analysts with a powerful simulation tool for solving industry’s most challenging multiphysics applications. |
Solutions Chart
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Fluid-structure interaction of a three-lobe valve, simulation solved using
the ANSYS Multi-field Solver. The model includes Non-Newtonian blood flow
and anisotropic hyperelasticity to model the biological tissue. |
Structural Analysis
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Static, modal, harmonic and transient analysis
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Spectrum analysis
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Buckling analysis
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Random vibration
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Geometric, material and contact nonlinearities
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Displacements transferred to thermal, electric, magnetic or fluid analysis
Thermal Analysis
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Steady-state and transient analysis
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Spectrum analysis
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Conduction, convection and radiation
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Phase change
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Mass transport
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Fluid elements
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Temperature-dependent material properties
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Temperatures transferred to structural, electric, magnetic or fluid analysis
Electrostatic Analysis
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Charge-based electric elements
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Trefftz method for open domain
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Electrostatic forces transferred to structural analysis
Steady-State Current Conduction
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Current-based electric elements
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Infinite elements for open domain
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Currents transferred to magnetostatic analysis
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Resistive losses transferred to thermal analysis
Low-Frequency Electric Field Analysis
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Charge and current based elements
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Infinite elements for open domain
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Time-harmonic and time-transient quasistatic
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Resistive and dielectric losses transferred to thermal analysis
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Currents transferred to magnetic analysis
Magnetostatic Analysis
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Magnetic vector potential and scalar potential elements
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3-D edge flux element formulation
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Resistive losses transferred to thermal analysis
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Magnetic forces transferred to structural analysis
Low-Frequency Magnetic Analysis
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Magnetic vector potential elements
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3-D edge flux formulation
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Quasistatic magnetic
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Time-harmonic analysis for linear materials
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Time-transient analysis for linear and nonlinear materials
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Permeable and saturable materials
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Permanent magnets
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Resistive and eddy current losses transferred to thermal analysis
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Magnetic forces transferred to structural analysis
High-Frequency Electromagnetic Analysis
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First- and second-order tangential vector elements
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3-D brick, pyramid, prism and tetrahedral element shapes
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Cavity modal analysis
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Harmonic analysis: wave propagation, radiation and scattering
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Isotropic and anisotropic materials
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SPICE-equivalent circuit output
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Resistive and dielectric losses transferred to thermal analysis
Circuit Analysis and Coupling
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Coupled electromagnetic field analysis and discrete electric circuits
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Resistors, capacitors, inductors, diodes, transformers, voltage and current sources
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Electromechanical transducer
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Interactive circuit builder
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Coupling to both stranded and massive conductors
Ion Optics
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Charged-particle tracing in electric or magnetic static fields, or both
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Plot trajectories in 2-D or 3-D
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Fluid Flow Analysis
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Tetrahedral, hexahedral, prism and/or pyramid elements
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Steady-state and transient flow
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Laminar and turbulent flows
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Incompressible, compressible – subsonic, transonic, supersonic
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Rotating or stationary frame of reference
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Conjugate heat transfer
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Radiation
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Newtonian and non-Newtonian fluids
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User-defined equations and species transport
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Free surface modeling
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Fluid structure interaction
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Fluid pressures and temperatures transferred to structural analysis
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Heat flux and temperatures transferred to thermal analysis
Acoustics
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Modal, harmonic and transient analysis
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Fluid medium
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Fully coupled fluid–structural
Direct Coupled-Field Elements
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Piezoelectricity
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Piezoresistivity
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Piezocaloric effect – Thermoelastic damping
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Coriolis effect
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Electroelasticity
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Thermoelectricity – Joule heating, Peltier, Seebeck and Thomson effects
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Thermal–structural
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Thermal–electric–structural
Sequential Coupling Options
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Electrostatic–structural
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Electrostatic–structural–fluid
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Thermal–structural
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Thermal–electric
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Thermal–electric-structural
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Thermal–electric–fluid
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Thermal–fluid
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Electromagnetic–thermal
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Electromagnetic–structural
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Electromagnetic–fluid
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Electromagnetic–thermal–structural
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Fluid structure interaction
Optimization
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Design optimization
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Topological optimization
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Probabilistic design
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Variational technology
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Parametric simulation
ANSYS Parametric Design Language
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Macros
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Parametric modeling
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If-then-else constructs
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Do-loop features
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Array parameters
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Array parameter operations
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Trigonometric functions
Solvers
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Sparse direct
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Jacobi conjugate gradient (JCG)
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Incomplete Cholesky conjugate gradient (ICCG)
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Pre-conditioned conjugate gradient (PCG)
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Quasi-minimal residual (QMR)
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Algebraic multigrid (AMG)
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Eigensolvers
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Block Lanczos
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PCG Lanczos
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Supermode modal solver
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Householder (reduced)
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Unsymmetric QR-damped
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Resources
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