ANSYS Icepak: Computational Fluid Dynamics (CFD) Software

ANSYS Icepak Announcement

ANSYS Icepak 4.4:  Unparalleled Speed and Design Automation Capabilities

Icepak 4.4 brings you advanced model building capabilities including enhanced direct representation of CAD geometries coupled with one of the fastest and most accurate solver engines –FLUENT 6.3. In addition, Icepak 4.4 brings many features, including enhanced trace and via modeling of printed circuit boards (PCB) and package substrates, which are designed to reduce the time and effort required to model today’s complex electronics components and systems.

Flow pathlines around an inductor coil represented directly as CAD data in a system level thermal design

The new ability to generate a direct representation of a CAD geometry has allowed Icepak to handle increasingly complex geometries, provide more flexibility and function with a higher degree of automation. In this version, Icepak’s Hex-Dominant meshing technology, which provides fast and optimal meshing of CAD geometries, is further enhanced to handle even the most complicated of shapes. Icepak 4.4 introduces new techniques, such as mesh smoothing and mesh surface recovery, to create body-fitted meshes for complex CAD geometries.

Hex-dominant mesh on an inductor coil

Icepak 4.4 also introduces enhanced import and modeling of trace and via details from the MCM/BRD and Gerber files of PCBs and package substrate layouts. Icepak 4.4 accurately models the effects of traces and vias on PCBs and package substrates by automatically generating thermal conductivity distributions based on local trace and via densities and their properties. This allows you to accurately account for the effect of traces and vias on the thermal performance of PCBs and packages.

Rapid heatsink design in Icepak making use of periodic boundary conditions

In addition, Icepak 4.4 is capable of exploiting the periodicity in a domain to vastly reduce the model size, which leads to a reduced computational cost. This version also offers complete flexibility in creating parametric design trials, parameters and reports, as well as, faster pre-processing and solution, improved turbulence modeling capabilities, enhanced libraries including thermo-electric cooler modules and enhanced macros.

Thermal conductivity distribution (k_x) on a multi-die package substrate

See for yourself why Icepak 4.4 helps you to design better and faster with one of the fastest and most accurate solver engines -FLUENT, and unlimited technical support to ensure your success.